Next Generation Copper Bonding Technology
Aktino's technology is a powerful new way of bonding copper pairs and defines the next generation of copper bonding technology. By performing bonding at the physical layer, Aktino's technology overcomes the problems of existing bonding methods and enables the delivery of high quality, high bandwidth broadband services network-wide.

Aktino is the first company to utilize standard based DMT (ADSL2, VDSL2) and MIMO (Multiple Input Multiple Output) techniques in the wireline domain for copper bonding. The result is a standards-based groundbreaking approach to copper bonding that takes multiple copper pairs and bonds them together at the physical layer in a way that enables the transmission of more bandwidth to greater distances with more reliability over copper loops than leagacy copper bonding technologies like HDSLx and E.SHDSL.

Some of the key advantages Aktino's next generation copper bonding technology provides compared to leagcy bonding technologies like HDSL or E.SHDSL are: 

    •Provides up to 100 Mbps to 12 Kft/3.7 Km

    •Requires only one-third to one-half the number of pairs are required by legacy 
     bonding technologies like HDSL or E.SHDSL to deliver the same bandwidth 

    •Reaches 2-4 times more customers ensuring services can be delivered network-wide

    •Provides high immunity to noise and line impairments ensuring fiber-like reliability even in
     harsh environments  

    •Provides fast recovery from pair failures or temporary outages

    •Compatible with Dynamic Spectral Management used to optimize ADSL performance from
     DSLAMs, make the Aktino solution inherently more spectrally friendly to the large ADSL
     installed base

    •Fully T1.417 compliant DMT line code with industry standard tone spacing and symbol rates

All these advantages translate into increased rate, reach and reliability that enable providers to leverage their existing copper infrastructure to quickly provide profitable and lasting broadband services.